http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170123002-A

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02005
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filingDate 2016-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a595d6ff39cff2b25e851550fd2c167d
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publicationDate 2017-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20170123002-A
titleOfInvention Resin bonded diamond wire saw
abstract The present invention relates to a resin-bonded diamond wire saw, and more particularly, to a resin-bonded diamond wire saw having an abrasive grain layer formed by bonding a resin to a circumferential surface of a bare wire with a bonding agent, The diamond particles are formed on at least a part of the surface of the metal coating layer in which a plurality of projections are formed on the surface. According to the present invention, by increasing the surface area of the diamond particles, the adhesion area with resin can be increased to increase the adhesion strength at the time of abrasive graining. By treating a metal such as nickel with an electroless plating method, The effect of increasing the surface area of the particles can be obtained.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109435085-A
priorityDate 2016-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 30.