| abstract |
The present invention provides a polyamideimide film in which mechanical properties and heat resistance are greatly improved while maintaining the following transparency. The polyamide imide is excellent in transparency, heat resistance, mechanical strength and flexibility and can be used as a substrate for a device, a cover substrate for a display, an optical film, an IC (integrated circuit) package, an adhesive film, a multilayer FRC ), Tapes, touch panels, protective films for optical discs, and the like. |