| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a665d61597c2731ab4130971ee397dc9 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate |
2016-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d689bf4bb622a67c9d0f624ae51ee8cd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2cbc2d0b166ec5cd62d9177a84c5e8c7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e221f95aa0c72a7bb10b2eef66f0a3c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd836f00fdf0fa376bc6038ada80053c |
| publicationDate |
2017-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20170118685-A |
| titleOfInvention |
Composition for polishing, polishing method and method for producing hard-brittle material substrate |
| abstract |
A polishing composition for polishing a surface of an object to be polished comprising a metal or a semi-metal oxide or a composite material thereof, the polishing composition comprising at least water and silica, and the silica is a polishing composition having a particle diameter of 20 nm or more and 70 nm or less Silica and a large diameter silica having a particle diameter of 100 nm or more and 200 nm or less, wherein the silica having a small particle size is contained in the polishing composition in an amount of 2 wt% or more, the silica having a large diameter is contained in the polishing composition in an amount of 2 wt% Wherein a value obtained by dividing the average particle diameter of the silica by the average particle diameter of the small particle size silica is 2 or more. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102237346-B1 |
| priorityDate |
2015-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |