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filingDate 2017-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eabc314a54b99e80cefa175e5cd70140
publicationDate 2017-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20170114919-A
titleOfInvention Method of manufacturing light-emitting device
abstract The present invention provides a method of manufacturing a light emitting device capable of maintaining a sufficient thickness in a covering member covering a side surface of a light transmitting member while suppressing a cutting amount of a transparent member provided on the light emitting element. According to the present invention, a first light emitting element and a second light emitting element are separated from each other and flip chip mounted on a substrate, a first light transmitting member having a first side is bonded onto the first light emitting element, A second light-transmitting member having a first side and / or a second side is adhered to the second light-emitting element so that the second side faces away from and facing the first side, and the first side and / / RTI &gt; to form a light-reflective covering member on the substrate, exposing the first side or the second side and covering the first side or the first side and the second side or the second side, There is provided a method of manufacturing a light emitting device that cuts the substrate and the covering member between the first side surface and the second side surface or between the first side surface and the second side surface.
priorityDate 2016-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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