| titleOfInvention |
Polyimide, polyimide-based adhesive, film-shaped adhesive material, adhesive layer, adhesive sheet, copper foil with resin, copper clad laminate and printed wiring board, and multi-layer board and manufacturing method thereof |
| abstract |
<Task> The present invention provides a novel polyimide exhibiting a high storage rigidity even under the temperature condition of the B stage, and a novel polyimide which is excellent in adhesion, heat resistance, flow control property and low dielectric property A novel polyimide-based adhesive, and a film-like adhesive obtained from the adhesive. [Solution] Diamine (B) containing an aromatic tetracarboxylic acid anhydride (A) and a dimer diamine (b1) and trimertiamine (b2) in the range of a mass ratio [(b1) / (b2)] of 97/3 to 70/30, (1), a crosslinking agent (2) and an organic solvent (3), and a film-like adhesive material obtained from the polyimide-based adhesive agent . |