http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170113297-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c999fee6428152a996011d506925c2d7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4261 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate | 2017-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1c3a7380881df3d249afad952be30da |
| publicationDate | 2017-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20170113297-A |
| titleOfInvention | Thermosetting resin composition |
| abstract | [PROBLEMS] To provide a thermosetting resin, an adhesive film, a method of manufacturing a wiring board using the same, a wiring board, and a semiconductor device, which are excellent in dimensional accuracy and reflow resistance when a wiring board having a buried wiring layer is manufactured, offer. A thermosetting resin comprising (a) an epoxy resin, (b) a butadiene structure which may be hydrogenated and a phenolic hydroxyl group, (c) a phenoxy resin, and (d) ) And the component (c) is a compound having a flexible structure selected from an alkylene structure having an alkylene structure having 2 to 20 carbon atoms and an ether bond having 2 to 20 carbon atoms , and the component (d) is not less than 30% by mass based on 100% by mass of the nonvolatile component in the thermosetting resin composition, and the cured product obtained by thermosetting the thermosetting resin composition has a modulus of elasticity, fracture strength, 1 Gpa or more and 6 Gpa or less, 10 Mpa or more, and 6% or more. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200080468-A |
| priorityDate | 2016-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 251.