http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170107598-A

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filingDate 2016-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_511bf6dbf19a8239b1b59b991e82ee17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca446650858abb5229b8463bbfa05816
publicationDate 2017-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20170107598-A
titleOfInvention Semiconductor test socket and menufacturing method thereof
abstract The present invention relates to a semiconductor test socket and a manufacturing method thereof. The semiconductor test socket according to an embodiment of the present invention comprises an insulating main body made of an insulating material having elasticity and a plurality of conductive pattern portions, which are electrically insulated from each other inside the insulating main body and each form a conductive line in the vertical direction. One conductive pattern potion includes a pair of first conductive pins spaced apart from each other in the horizontal direction and a pair of second conductive pins spaced apart from the first conductive pin in the depth direction and spaced apart from each other in the horizontal direction. The pair of first conductive pins has a shape bent in the horizontal direction. The pair of second conductive pins has a shape bent in the horizontal direction, opposite to the first conductive pins. Each pair of the bent first conductive pins and each pair of the bent second conductive pins form one conductive pattern potion to form one conductive line in the vertical direction, and then an insulating main body is made of an elastic material such as silicon. Therefore, a more stable conductive line can be formed in the vertical direction.
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type http://data.epo.org/linked-data/def/patent/Publication

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