| abstract |
The present disclosure relates to an apparatus and method for manufacturing a channel-coupled scaffold. Specifically, the present specification discloses a method of manufacturing a semiconductor device, comprising: (1) compressing a first elastic substrate including a groove on a surface of a substrate to close a groove; (2) loading the scaffold composition onto the closed groove; And (3) restoring the elastic substrate to its original state. The present invention also provides, in one aspect, a first elastic substrate comprising a groove on a surface of a substrate and onto which a scaffolding composition is loaded; And a compression module for compressing the width of the elastic substrate to close the groove of the elastic substrate. |