| abstract |
The present invention relates to a thermoplastic composition comprising at least one polyamide preferably having a melting point of less than 185 占 폚 and preferably at least one liquid polysiloxane compound having a viscosity of 750 to 100,000 mPa.s and OH-terminated at 25 占 폚 Wherein the thermoplastic composition is obtainable by a process comprising the steps of: 1a) heating at least one polyamide at a temperature above the melting point of the at least one polyamide and preferably below 185 ° C; 2a) adding at least one liquid polysiloxane with stirring to the heated compound (s) of step la), wherein the temperature is above the melting point of the at least one polyamide and preferably below 185 ° C; And 3a) Mixing the resulting mixture of step 2a), preferably at a temperature of from 80 ° C to 180 ° C, more preferably from 110 ° C to 140 ° C. The use of thermoplastic compositions according to the invention as sealants, in adhesives, or as rheological modifiers or surface modifiers. Further, a hot melt adhesive comprising the thermoplastic composition according to the present invention. And the use of these hot melt adhesives in automotive parts, buildings, windows, glazing, sanitary equipment, fittings, roofing materials, plumbing, electronic appliances and plate glass bonding. |