| abstract |
Applying a first composition comprising an organic compound to a substrate having a plurality of patterns to form a first organic layer; removing a portion of the first organic layer by applying a solvent to the first organic layer; (S3) of forming a second organic layer by applying a second composition containing an organic compound on the first organic layer from which a part of the organic compound has been removed, followed by curing, And a semiconductor device manufactured according to the pattern forming method. |