http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170085440-A

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filingDate 2017-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50d9f4fbafb79496d704ea8263bad0e1
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publicationDate 2017-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20170085440-A
titleOfInvention Copper foil and methods of use
abstract This disclosure relates to nickel plated copper foil. The plated copper foil is particularly useful in PTC (Positive Temperature Coefficient) devices. The plated copper foil has a surface hardness of 50 to 200, a tensile strength of more than 45 kg / mm 2 and a gloss surface roughness (Rz) of 2.0 μm or less. The surface roughness (Rz) of the matte surface of the copper foil is in the range of 6 to 10 mu m. A copper nodule is present on the matte surface of the copper foil between the copper foil and the nickel plating. Methods of manufacturing copper foil and PTC devices are also disclosed.
priorityDate 2016-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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