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publicationDate 2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20170082181-A
titleOfInvention Method of forming conductive pattern
abstract Applying a first solution comprising a metal reducing agent on a substrate to form a buffer layer; applying a second solution on the buffer layer; and performing a drying process on the buffer layer to which the second solution has been applied Wherein the metal reducing agent comprises a first metal and the second solution comprises ions of a second metal different from the first metal and wherein during the drying process the second metal Ions may be reduced to form a metal layer on the inside and the surface of the buffer layer.
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