| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0716 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1658
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1893
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1889
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-208
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1841 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate |
2016-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_154d0cfa0a5ef11f304810712f92500b |
| publicationDate |
2017-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20170074765-A |
| titleOfInvention |
Environmentally friendly stable catalysts for electroless metallization of printed circuit boards and through-holes |
| abstract |
The catalyst comprises a catalytic metal and a nanoparticle of maltodextrin as a molar ratio stabilizer, which stabilizes the catalyst during storage and during electroless metal plating. The catalyst is environmentally friendly and tin-free. The catalyst adheres well to the dielectric material of the printed circuit board including the through-hole walls. |
| priorityDate |
2015-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |