| abstract |
The pattern processing method includes the steps of: (a) providing a semiconductor substrate including a patterned feature on a surface; (b) applying to the patterned feature a pattern processing composition comprising a polymer and solvent comprising a surface affixer for forming a bond with a surface of the patterned feature, wherein the pattern treating composition does not comprise a crosslinking agent; (c) removing the residual patterning composition from the substrate with a first rinse, leaving a coating of the polymer bound to the surface on the surface of the patterned feature; And (d) rinsing the polymer-coated patterned features with a second rinse agent different from the first rinse agent, wherein the polymer has a greater solubility in the first rinse agent than in the second rinse agent, And rinsing. The method is particularly applicable to the fabrication of semiconductor devices for providing high resolution patterns. |