| abstract |
An epoxy resin composition capable of exhibiting excellent flame retardancy in a cured product, excellent in dielectric properties such as low dielectric constant tangent and low dielectric constant, and capable of having excellent thermal conductivity, a prepreg using the same, In order to provide a substrate, a build-up film, a build-up substrate, a semiconductor encapsulating material, a semiconductor device, a fiber reinforced composite material and a molded product, a triazine ring-containing phenol obtained by reacting melamine, para- Resin is used. |