abstract |
A photosensitive resin composition which is excellent in sensitivity and developability, excellent in suppression of light irradiation of a cured product and suppressed in reduction of reflectance due to heat, and also excellent in touch-to-dryness, inhibition of discoloration and prevention of spillage, its dry film and cured film, A printed wiring board is provided. (A) a photosensitive resin composition comprising a carboxyl group-containing resin having (A) a styrene skeleton, (B) a photopolymerization initiator, and (C) an inorganic filler, wherein the weight average molecular weight of the carboxyl group- 50,000, and an acid value of 80 to 200 mgKOH / g. |