| abstract |
A thermosetting adhesive composition and a thermosetting adhesive sheet capable of suppressing resin seizure. The thermosetting adhesive composition of the present invention constituting the thermosetting adhesive sheet 20 comprises an acrylic copolymer, a thermosetting epoxy resin, an epoxy resin curing agent, a dendritic conductive filler 21, Conductive filler (22). As a result, since the non-conductive filler 22 is entangled with the resin-made conductive filler 21, the flow of the resin component is suppressed and the metal plate 30 and the terminal 11 are electrically connected do. |