http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170061035-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d09868fae6f26ac51848cb2f01354344 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0127a0cabe1f5479951c011c12e1b6ca http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9c9408f9740d948b34170a8e7bb454bd |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-202 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate | 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36390662ac80a9e2a6f6910661a96da4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82172472de5dcc18a11275bcd87a7161 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a76b568d24ecef3064ef5b372d3c1f52 |
| publicationDate | 2017-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20170061035-A |
| titleOfInvention | Metal flexible printed circuit borad and method for manufacturing the same |
| abstract | The present invention relates to a method for manufacturing a flexible printed circuit board by applying an adhesive comprising a base having flexibility and a curing agent mixed with a base including a diglycidyl ester epoxide resin and a cycloaliphatic expoxide resin, Bonding the first metal thin film to the first adhesive layer by heating and bonding; Forming a first circuit layer by patterning the first metal thin film; Forming lands on the first circuit layer by application of a conductive material for connection and forming a second adhesive layer on the first circuit layer by applying the adhesive to an area other than the land; Heating and bonding the second metal thin film on the second adhesive layer; And forming a second circuit layer by patterning the second metal thin film, and a method of manufacturing the MFPCB. According to the present invention, by using a resin having excellent ductility as an adhesive, flexibility can be maximized, dielectric properties can be improved, thermal deformation temperature (155 캜) can be increased to secure thermal stability and bending strength and elasticity (30,000 kg / cm2), it is possible to increase the repetitive fatigue strength and lower the coefficient of linear expansion, thereby remarkably lowering the distortion due to thermal deformation. |
| priorityDate | 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.