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filingDate 2015-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_775f9c59b176ddd7e1a0840f7edcade8
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publicationDate 2017-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20170055642-A
titleOfInvention A silver coating method for copper powder used circuit printing and adhesive conductive paste
abstract The present invention relates to a method of coating copper powder with silver, applicable to paste for circuit printing and a conductive adhesive. The method of coating copper powder with silver coats copper powder with silver using potassium sodium tartrate and ascorbic acid to make the copper powder have conductivity similar to a conductivity of silver powder. The method of coating copper powder with silver, applicable to paste for circuit printing and a conductive adhesive comprises: a first step of dissolving silver salt and ammonia water to make solution 1; a second step of dissolving a surface-active agent and a reducing agent in distilled water to make solution 2; a third step of removing foreign substances on a surface of copper powder, performing surface activity on the surface of the copper powder by placing the copper powder into solution 2; a fourth step of depositing silver on a surface of copper, and coating the surface of the copper with silver by placing solution 1 into solution 2; and a fifth step of washing, with distilled water, the copper powder coated with silver in the fourth step, and drying the copper powder in a vacuum.
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priorityDate 2015-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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