| abstract |
A semiconductor device and a manufacturing method are provided. In an embodiment, a first semiconductor device and a second semiconductor device are formed in a semiconductor wafer, and a scribe region is patterned between the first semiconductor device and the second semiconductor device. A singulation process is then utilized in the scribe area to singulate the first semiconductor device from the second semiconductor device. The first semiconductor device and the second semiconductor device are then bonded and thinned to the second semiconductor substrate to remove extension regions from the first semiconductor device and the second semiconductor device. |