| abstract |
A thermosetting resin composition which is excellent in processability and cures to obtain a highly reliable cured product (molded article) having excellent heat resistance and mechanical strength. The thermosetting resin composition of the present invention comprises (A) a polyalkenylphenol resin, (B) an aromatic polymaleimide compound, and (C) a polymerization initiator, wherein the polyalkenylphenol resin (A) (A2) at least one aromatic ring unit having a phenolic hydroxyl group not bonded to a 2-alkenyl group, each of which has at least one aromatic ring unit bonded to the main chain And the ratio of m to (m + n) is (m + n), where m is the number of the aromatic ring unit in (a1) (A) a polyalkenyl phenol resin in an amount such that the amount of a 2-alkenyl group is from 0.4 to 1.5 moles per mole of the maleimide group of the aromatic polyimide compound (B). |