| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_25305611f3c26078753e3bdc7b49366c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2015-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a183887bc3a76db40f53ae124290e2d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e0e5ba9c2ddbad56cd56cfeb3ed8b3b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e992a4e8a4c3b30892343acf4b3277d |
| publicationDate |
2017-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20170044522-A |
| titleOfInvention |
Slurry composition for chemical mechanical polishing, method of preparing the same, and polishing method using the same |
| abstract |
TECHNICAL FIELD The present invention relates to a slurry composition for chemical mechanical polishing, a method for producing the same, and a polishing method using the same, which comprises ceria particles having NO 3 functional groups adhered on its surface; And a dispersion medium. The present invention also provides a slurry composition for chemical mechanical polishing. At this time, the content of the ceria particles may be about 0.1 part by weight to about 15 parts by weight based on 100 parts by weight of the dispersion medium. The slurry composition for chemical mechanical polishing of the present invention has a small size of abrasive grains and does not cause a reduction in polishing rate, so that it is possible to produce a semiconductor product at a higher yield with a higher yield. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220033872-A |
| priorityDate |
2015-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |