| abstract |
There is provided a method of fabricating a thermal interposer using low stress photo-patternable silicon, wherein the thermal interposer is provided in a packaging of LED, logic and memory elements and other such semiconductor products requiring thermal management For use in the production of electronic products. A photopatternable silicone composition, a thermally conductive material and a low melting point compliant solder form a complete semiconductor package module. The photopatternable silicon is applied on the surface of the wafer and selectively irradiated to form openings, which provide the user with a definite bond line thickness control. The openings are then filled with a high-conductivity paste to form a high-conductivity thermal link. Subsequently, a low melting point curable solder is applied, where the solder not only wets the silicon but also the thermally conductive path, which results in a low thermal contact between the structured z-axis thermal interposer and the substrate and / Resistance. |