| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ed62b7551998e54b35784cdbbb2778d5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02211
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0217 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4408
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4412
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4404
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02337
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67034
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2016-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e090649553fcfb5c7476753ad269d60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b61b95325a82a3becf0e1e0b4d0c0df8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b486a5e8528fe38fdd88f0946e210853
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f18bbabc5671e620a67fbc1e94eb5e81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_474c932f8beca75a8562f0bb1ff6ab4f |
| publicationDate |
2017-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20170037831-A |
| titleOfInvention |
Method of manufacturing semiconductor device, substrate processing apparatus, and program |
| abstract |
The removal effect of the compound generated by the cleaning treatment from within the treatment chamber is enhanced and the quality of the substrate treatment is improved. A step of processing the substrate by supplying a process gas to the substrate in the process chamber, a step of stepping up the inside of the process chamber by supplying purge gas into the process chamber, and a step of stepping down the process chamber by evacuating the process chamber, A step of performing a first purge in the process chamber while periodically fluctuating the pressure in the process chamber to a first pressure width by repeating a plurality of repetitions of the purge gas in the process chamber; And repeating this cycle a plurality of times to periodically fluctuate the pressure in the process chamber to a second pressure width smaller than the first pressure width, thereby performing a second purge in the process chamber. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190079524-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190035469-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11685992-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210052222-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210018147-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102326735-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200007699-A |
| priorityDate |
2015-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |