| abstract |
A method of fabricating a microelectronic device includes forming a microelectronic substrate having a plurality of microelectronic device attachment bond pads and at least one interconnective bond pad formed on and / or within the active surface; Attaching a microelectronic device to a plurality of microelectronic device attachment bond pads; Forming a mold chase having at least one protrusion extending from the mold body and the mold body, the at least one protrusion including at least one sidewall and a contact surface; Contacting the mold chase projection contact surfaces with respective microelectronic substrate interconnecting bonding pads; Disposing a mold material between the microelectronic substrate and the mold chase; And removing the mold chase to form at least one interconnecting via extending from the top surface of the mold material to the respective microelectronic substrate interconnect pad. |