| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_98f92c496e4f5c70f34681fb4bf526d2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0792
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4813
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-146 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-4483
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N29-2406
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0292
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N29-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B06B1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B8-00 |
| filingDate |
2015-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a05e9a4a3314a9dbf92800121f70680a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fca759faaaf0e67dc3443e9087bed922
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9016b59d3a299e608b7c390fa3eaa783
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_048db0aa319da11ac3d3c76671a9b01d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ded577b80a06de2133f3ca81364afef1 |
| publicationDate |
2017-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20170030605-A |
| titleOfInvention |
Microfabricated ultrasonic transducers and related apparatus and methods |
| abstract |
Fabrication methods of these devices as well as micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described. Fabrication may involve two separate wafer bonding steps. Wafer bonding can be used to fabricate sealed cavities 306 in the substrate 302. Wafer bonding can also be used to bond the substrate 302 to another substrate 304, such as a CMOS wafer. At least a second wafer bonding may be performed at a low temperature. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210008509-A |
| priorityDate |
2014-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |