http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170026729-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_070875329d2add3d65875c6c1b27108a |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-0026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-0033 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21K99-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 |
filingDate | 2015-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20a1e67bfe8c4ba47f7d0feb4ec9bf90 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b5d2a485201f3d39fafa44907bd214a |
publicationDate | 2017-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-20170026729-A |
titleOfInvention | Light sintering apparatus of metal nano particle composition and method for manufacturing conductive substrate using the same |
abstract | The present invention relates to a light sintering apparatus of metal nanoparticle composition and a method of manufacturing a conductive substrate using the same, for forming a conductive layer having good electrical and physical properties through light sintering after coating a substrate with metal nanoparticle composition. The light sintering apparatus according to the present invention includes a substrate mounting unit and a dual light sintering unit. The substrate mounting unit is mounted thereon with a substrate formed thereon with a coating layer coated with the metal nanoparticle composition containing copper nanoparticles, and has an opening to expose a lower portion of the substrate. In addition, the dual light sintering unit is installed above the substrate mounting unit and below the opening of the substrate mounting part to form a conductive layer by light sintering the coating layer by irradiating the top and bottom of the substrate with light. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190036211-A |
priorityDate | 2015-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.