| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d3082cd39bb800686b9abbb8aa05c80b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate |
2015-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e6ff7cd8b4f833331f09711671f6655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca0930027d9774f1de4e38d44257b31f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f23706df4695befc0836329edb5fcec2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9a05f507df5e833e72d83725bfa8cc2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58c822d226bd9636a3eeb6b68fa6ce21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39c6e73983b7b0926d6cf54503db1b93 |
| publicationDate |
2017-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20170026492-A |
| titleOfInvention |
Copper barrier chemical-mechanical polishing composition |
| abstract |
The chemical-mechanical polishing composition comprises colloidal silica abrasive particles into which a chemical compound is incorporated. The chemical compound may comprise a nitrogen-containing compound such as an aminosilane or a phosphorus-containing compound. The method of using such a composition includes applying the composition to a semiconductor substrate to remove at least a portion of at least one of copper, copper barrier, and dielectric layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020091242-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210046497-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210053082-A |
| priorityDate |
2014-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |