| abstract |
The LED illumination unit includes a support structure 14, an LED-based light emitting structure 10 mounted within the support structure, and an optical beam shaping arrangement 50, 52 on top of the support structure. The optical beam shaping arrangement comprises optically transparent and thermally stable material, and the support structure supports the microstructured layer at a small height above the LED-based light emitting structure. This height may for example be less than 0.5 mm. The optical beam shaping arrangement allows a compact, low-height lighting unit to be mounted on the carrier by reflow soldering without damaging the optical beam-shaping element. |