| abstract |
A wiring structure and method is disclosed that includes a conductive feature with reduced topography variation. The wiring structure includes contact pads disposed on the substrate. The contact pad includes a first layer of a first conductive material and a second layer of a second conductive material over the first layer. Wherein the first conductive material and the second conductive material are of substantially the same material and wherein the first conductive material has a first average particle size and the second conductive material has a second average particle size smaller than the first average particle size . The interconnect structure also includes a passivation layer covering the substrate and the contact pad and having an opening exposing the contact pad. |