http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170019062-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d3e468ee17d7a0e32163938e5d630fef |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2886 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2863 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06705 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2887 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2893 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2601 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2865 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2015-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e06f547d1a0390a68074669258752e82 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1e987f2b42e13b2646ce042c7162581 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fbef94cb18942f0ebe8576aeb1742920 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ced808220a665d6d70315c3b686d2639 |
| publicationDate | 2017-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20170019062-A |
| titleOfInvention | Probe Bonding Device and Probe Bonding Method Using the Same |
| abstract | At least one tray on which a plurality of probes are seated; A first gripper for gripping a probe placed on the tray; A forming unit that receives the probe from the first gripper and mechanically aligns the probe; A soldering portion having at least one lead-in which the solder paste is received and moving on a plane including the x-axis and the y-axis, a syringe positioned above the lead-casting portion to supply solder paste to the lead, A dipping unit having a squeegee for flattening an upper surface of the solder paste supplied to the lead tank by the dipping unit; A chuck unit for fixing a substrate to which the probe is bonded; A second gripper holding the probe aligned by the forming unit, dipping the probe on the lead to apply the solder paste to a lower portion of the probe, and moving the probe to a bonding position on the substrate; A laser unit for irradiating a laser to solder the probe to an electrode of the substrate; A first vision means for mapping the position of the probe seated in the tray; And a fourth vision means for confirming whether the probe gripped by the second gripper and moved on the substrate is positioned at a proper position to be bonded, and a bonding method using the probe bonding apparatus, The syringe paste dipping process can be efficiently performed by eliminating the means for moving the syringe and the squeegee. |
| priorityDate | 2015-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.