| abstract |
A copper foil with a carrier having good fine circuit forming property is provided. The carrier-coated copper foil having a carrier, an intermediate layer and an ultra-thin copper layer in this order, wherein a thickness of the carrier-coated copper foil measured by a gravimetric method except for the carrier and the intermediate layer is D1 and the carrier- triazine resin substrate pressure after affixed by hot pressing under the conditions of 2 hours at 20kgf / cm 2, 220 ℃, when referred to peel off the carrier and D2 to the maximum thickness of the layer remaining on the resin substrate, D2-D1 are 0.30 to 3.83 탆. |