| abstract |
The present invention relates to a modified epoxy resin. The resin according to the present invention has low dielectric constant and low dielectric loss factor while having excellent adhesive properties and heat resistance properties. Therefore, the resin is used in a laminate for a semiconductor package, a high frequency transmission laminate, a copper clad laminate (CCL), a flexible display substrate, or an insulating plate, and has advantages for being used as an adhesive, a coating agent, or an encapsulant for a semiconductor. |