| abstract |
Disclosure of the Invention The present invention provides an electronic component in which sealing is sealed using a liquid sealing material and a liquid encapsulant that both achieve low thermal expansion and embeddability to the gap between the semiconductor element and the substrate We will do it. In order to solve the above problems, the liquid encapsulant of the present invention is a liquid encapsulant comprising (A) a liquid epoxy resin, (B) a curing agent, (C) 2- (3,4- (D) a silica filler having an average particle diameter of 0.2 to 5 占 퐉, wherein the silica filler of the component (C) and the silica filler of the component (D) are contained in an amount of 100 parts by mass based on the total 100 parts by mass of the total components of the liquid encapsulant. (Mass ratio) of the silica filler of the component (C) to the silica filler of the component (D) is 1: 10.2 to 1: 559, and the total content of the silica filler of the component do. |