abstract |
The present invention provides a conductive paste having a viscosity suitable for hole filling of a substrate, a long pot life, and excellent conductivity and long-term reliability of a cured product, and a multi-layer substrate using the conductive paste. (A) 100 parts by mass of dimeric acid-modified epoxy resin (B) comprises 200 to 1900 parts by mass of a high-melting-point metal powder having a melting point of 800 占 폚 or more containing a coated copper alloy powder, (C) 400 to 2,200 parts by mass of silver-coated copper alloy powder having a melting point of 800 占 폚 or more, (D) , And (E) 5.0 to 100.0 parts by mass of a flux containing a polyvalent carboxylic acid is used as the conductive paste. |