| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a8a9982b1666c54b5bf02d6c944891e4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68359
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C15-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-15 |
| filingDate |
2015-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0786916ccce3c1ed3fdfe422549caddc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a670536293721ca1aa796fab37281c1 |
| publicationDate |
2016-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20160145801-A |
| titleOfInvention |
Etch Back Processes of Bonding Material for the Manufacture of Through-Glass Vias |
| abstract |
A method of manufacturing a via in a glass substrate includes bonding a first side of the glass substrate including a plurality of holes to a first side of the glass carrier through a bonding layer. The bonding layer has a thickness (t) between a first side of the glass substrate and a first side of the glass carrier and extends from the first side of the glass substrate to a depth (h) through at least several of the plurality of holes have. The method includes etching back the bonding layer at depth (d) through a plurality of holes in the glass substrate. The depth d is smaller than the sum of the thickness t and the depth h. The method may include filling a plurality of holes with an electrically conductive material and de-bonding the glass substrate from the bonding layer and the glass carrier. |
| priorityDate |
2014-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |