http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160140874-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1543b2b19ec0e331a0dcd89888cbef5f |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B7-241 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B7-228 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24 |
| filingDate | 2015-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d12faaab890ecfee6174d049a93d91bb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_349f550f694881e28237f8e5937502cd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19533bed3af259865ff60a3015d89677 |
| publicationDate | 2016-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20160140874-A |
| titleOfInvention | Polishing pads and systems and methods of making and using the same |
| abstract | The present invention relates to a polishing pad comprising a polishing layer, wherein the polishing layer comprises a working surface and a second surface opposite the working surface. The work surface includes at least one of a plurality of precisely shaped pores and a plurality of precisely shaped protrusions. The present invention also relates to a polishing system comprising the above-described polishing pad and a polishing solution. The present invention relates to a method of polishing a substrate, the method comprising: providing a polishing pad according to any of the preceding polishing pads; Providing a substrate; Contacting the working surface of the polishing pad with a substrate surface; And moving the polishing pad and the substrate relative to each other while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is performed in the presence of the polishing solution. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022091069-A1 |
| priorityDate | 2014-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.