http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160133864-A

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publicationDate 2016-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20160133864-A
titleOfInvention Anisotropic conductive film and the semiconductor device using thereof
abstract The present invention provides a laminate comprising a first layer comprising an epoxy resin and a thiol compound; And an anisotropic conductive film comprising a second layer comprising an epoxy resin and an ionic curing catalyst, wherein at least one of the first layer and the second layer further comprises conductive particles. The present invention also relates to an anisotropic conductive film comprising an epoxy resin, a thiol compound, an ionic curing catalyst and conductive particles, wherein the rate of change of calorific value according to the following formula 1 is 10% or less. [Formula 1] Heating rate change rate (%) = [(H 0 -H 1 ) / H 0 ] × 100 In the above formula (1), H 0 represents the calorific value on DSC measured after leaving the anisotropic conductive film at 25 ° C for 1 day, and H 1 represents the calorific value on DSC measured after leaving the anisotropic conductive film at 25 ° C for 7 days. The anisotropic conductive film according to one example of the present invention has an advantage that the thiol compound and the ionic curing catalyst are contained in different layers, respectively, so that the stability at room temperature is excellent and cryogenic temperature can be lowered.
priorityDate 2015-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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