| abstract |
A first resin layer comprising a first curable resin composition comprising a polyphenylene ether oligomer (A1) whose terminal is modified with an aromatic vinyl group and a curing agent (A2), and a first resin layer comprising a polar group-containing alicyclic olefin polymer (B1) B2) and a second resin layer comprising a second curable resin composition, and a prepreg comprising a fiber substrate, a laminate obtained by using the same, a cured product, a composite and a multilayer A circuit board is provided. |