Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2261-131 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0206 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
filingDate |
2016-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_223d82a1b8e964c7d0bd2b239c236c10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97a550ae38d355a45ec32d4daecb2da6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b13d7e37315aef8122cc493b8ab4a245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d5ab6ecea314572f5725f67d031dc98 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_102332f69ea9dfc962595f255383bc66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55631e4ad55a87a48cc03410d7e394e3 |
publicationDate |
2016-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20160127647-A |
titleOfInvention |
Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper deposits |
abstract |
The copper electroplating bath provides improved low internal stress copper deposits with good electrical conductivity. The copper electroplating bath comprises at least one branched polyalkyleneimine and at least one accelerator. The copper electroplating bath can be used to electroplate a thin film on a relatively thin substrate to provide a thin film copper deposit having low internal stress and high electrical conductivity. |
priorityDate |
2015-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |