| abstract |
Glass transition temperature (Tg), thermal expansion coefficient and / or thermal expansion coefficient that make the material useful for the manufacture of various electronic devices such as flip chip packages, stacked dies, hybrid memory cubes, silica-through vias (TSV) A thermally conductive underfill composition having a combination of transparency is provided. In certain embodiments of the invention, an assembly is provided comprising a first article permanently bonded to a second article by a cured liquor of the formulation described herein. In certain embodiments of the present invention, a method of bonding a first article to a second article is provided. In certain embodiments of the present invention, a method is provided for improving heat loss by an electronic device assembled using a thermally conductive or electrically non-conductive adhesive. |