http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160124347-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_64e377f32e86cf7be17f5847fd3c46d2 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2601 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2644 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0408 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate | 2015-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca446650858abb5229b8463bbfa05816 |
| publicationDate | 2016-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20160124347-A |
| titleOfInvention | Bi-directional conductive socket for testing high frequency device, bi-directional conductive module for testing high frequency device, and manufacturing method thereof |
| abstract | The present invention relates to a bidirectional conductive socket for testing a high-frequency device, which enables a micro-pattern to be implemented and is used to test a semiconductor element. The present invention also relates to a bidirectional conductive module for testing a high-frequency device and a method for manufacturing the bidirectional conductive module, which enable the bidirectional conductive socket for testing a high-frequency device to be easily assembled. A bidirectional conductive module for testing a high-frequency device according to an embodiment of the present invention comprises: a substrate unit which has a curved structure to have one end facing a semiconductor element and the other end facing a test circuit substrate; a plurality of first conductive patterns which are disposed at the one end of the substrate unit, and are electrically connected to respective terminals of the semiconductor element; a plurality of second conductive patterns which are disposed at the other end of the substrate unit, and are electrically connected to respective terminals of the test circuit substrate and the respective first conductive patterns; and an elastic support which is connected to the substrate unit to elastically support the substrate unit. In this case, the bidirectional conductive module is installed between the semiconductor element and the test circuit substrate, and electrically connects the terminals of the semiconductor element and the terminals of the test circuit substrate. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190096582-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102446242-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019156490-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11293943-B2 |
| priorityDate | 2015-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.