| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B11-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 |
| filingDate |
2016-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a28c7bbd922e381e7a25e445415f315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3072a5bb061d62c40bb06bea79a57073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0b8938ddc6c6f9db8ffe8f57a185e7e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a13f37237a5dc91012443f97652d2033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47e4e781405cbe082e477df2976e5200
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c20c3fe8ff8452663ba93cb7850efa24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2aeddb38682aa0c11f1c0cfe1f23c635 |
| publicationDate |
2016-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20160117316-A |
| titleOfInvention |
Method for producing epoxy resin granule for encapsulating semiconductor device, epoxy resin granule for encapsulating semiconductor device, method for producing semiconductor device, and semiconductor device |
| abstract |
According to the present invention, there is provided a process for producing an epoxy resin particulate material for semiconductor encapsulation, which is used for a semiconductor device in which a semiconductor device is sealed by compression molding, comprising the steps of: preparing an epoxy resin composition for semiconductor encapsulation; And a step of cutting the tip end portion of the resin mass composed of the epoxy resin composition for semiconductor encapsulation extruded from the extrusion molding machine by a hot cut method to obtain an epoxy resin particulate for semiconductor encapsulation, There is provided a method wherein the melting viscosity of the epoxy resin composition for semiconductor encapsulation at 175 캜 measured by a solidifying type flow tester is 0.5 Pa · S or more and 20 Pa · S or less. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11702537-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018236052-A1 |
| priorityDate |
2015-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |