| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1f142de52eae434d9888578064066822 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D1-86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-37 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D1-86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-37 |
| filingDate |
2016-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8044d7fbb2cd22265f9337c504969d72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b75e4a740797cdae687086fc2b6b1d3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2dd238d22a357849b88cb495013a9f0e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0b419c127537008e726314a272abf36 |
| publicationDate |
2016-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20160114558-A |
| titleOfInvention |
Cleaning solution for wafer and wafer process using the same |
| abstract |
0.01 to 30 wt% of a water-soluble polymer, 0.01 to 10 wt% of a surfactant, and the remaining amount of water. The wafer cleaning liquid of the present invention may be applied to a wafer dicing process or a wafer polishing process to remove impurities remaining on the wafer surface and improve the performance of the wafer product. |
| priorityDate |
2014-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |