http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160113216-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c97f90ab12b35b650d5fd039ed7a41a5 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10128 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0338 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-246 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
filingDate | 2015-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18af94a76611e9fa7d7a62ec69545ed3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ff25e017108fda26d54d06dc94bb831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dbb76fc304026bedfc062077ab929771 |
publicationDate | 2016-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-20160113216-A |
titleOfInvention | Electroconductive pattern, substrate with electroconductive pattern, method for manufacturing substrate with electroconductive pattern, structure having on-surface electroconductive pattern, and method for manufacturing said structure |
abstract | INDUSTRIAL APPLICABILITY The present invention can reduce the visibility of the conductive thin wire, lower the resistance value, improve the adhesion between the substrate and the conductive pattern, suppress the fluctuation of the resistance value even when the substrate is bent, A substrate having a conductive pattern, a method of manufacturing a substrate having a conductive pattern, a structure having a conductive pattern on its surface, and a method of manufacturing the structure, And at least a part of the fine wire has a multilayer structure, and the multilayer structure is a pattern comprising one or more kinds of conductive particles selected from the group consisting of conductive particles, conductive fillers, and conductive wires, A first layer 21 having a film thickness of less than 500 nm and a second layer 22 having a thickness larger than that of the first layer 21 and containing a metal as a main component And a gong. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190120273-A |
priorityDate | 2014-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.