abstract |
(A) a silicone resin having a structural unit represented by the following formula (1) and having a weight average molecular weight of 3,000 to 500,000, (B) an epoxy resin curing agent, (C) a filler The present invention relates to a resin composition comprising a plurality of wafers, and the present invention relates to a resin composition comprising a plurality of wafers which can be molded (wafer mold) in a lump, and having excellent moldability particularly for a large diameter and thin film wafers, And a resin composition and a resin film which can be suitably used in a wafer level package can be provided. |