| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e3b0a3dbf8d6c9712d86ea1383fd5327 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29139
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83439
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8384 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
| filingDate |
2014-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_136ab47c74fa2ccfba72c4c8e8fb099d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d922060f36c9e42a8dc3e9729f856cb8 |
| publicationDate |
2016-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20160102416-A |
| titleOfInvention |
Substrate for power module, method for manufacturing same, and power module |
| abstract |
An elongated groove 35 is formed so as to connect the Ag layer 32 and the exposed portion of the circuit layer diffused around the Ag layer 32. [ The groove 35 is an elongated concave portion that penetrates the glass layer 31 and the aluminum oxide film 12A from the surface of the Ag layer 32 to the surface 12a of the circuit layer 12. The groove 35 is formed with an extended portion 36 extending along the inner surface 35a of the groove 35 by extending a part of the Ag layer 32. The Ag layer 32 and the circuit layer 12 are directly electrically connected to each other by Ag having a low electrical resistance value in the portion where the groove 35 is formed by the extension portion 36. [ |
| priorityDate |
2013-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |