| abstract |
Embodiments of the present invention generally provide methods for sealing pores at the surface of a dielectric layer formed on a substrate. In one embodiment, the method comprises exposing a first layer of a substrate formed on a substrate to a first pore sealant wherein the first pore sealant comprises a compound of the general formula C x H y O z , wherein x Has a range of 1 to 15, y has a range of 2 to 22, z has a range of 1 to 3, and exposing the substrate to UV radiation in the atmosphere of the first pore sealant And forming a first sealing layer. |