| abstract |
SUMMARY OF THE INVENTION An object of the present invention is to provide a microstructure, a multilayer wiring board, a semiconductor package, and a method of manufacturing a microstructure, which can improve the dielectric strength of an insulating substrate while securing a fine conductive path. The microstructure of the present invention is a microstructure having an insulating base material having a plurality of through holes and a conductive path made of a conductive material containing a metal filled in the plurality of through holes, Is in the range of 5 nm to 500 nm and the average value of the shortest distance connecting the adjacent through holes is 10 nm to 300 nm and the water content with respect to the total mass of the microstructure is 0.005% or less. |