| abstract |
The present invention relates to a polyamide molding composition, in particular for the production of heat resistant moldings, having the following composition: (A) at least one polyamide molding composition in the form of copolyamide comprising units consisting of 50 to 80 mol% hexane diamine and terephthalic acid (B) from 1 to 15% by weight of at least one impact modifier, (C) from 20 to 60% by weight of at least one carbon fiber, (D) from 0 to 5% by weight of at least one additive, The sum of (A) to (D) is 100% by weight. |